Technology

Micro LED display

Neural devices

Acoustic sensor
Flexible LSI & package

 

Flexible Large Scale Integration (f-LSI)

     

     Silicon-based semiconductors have played significant roles of signal processing, nerve stimulation, memory storage, and wireless communication in implantable electronics. However, the rigid and bulky LSI chips have limited its uses in invivo and flexible devices.

     We have developed silicon-based flexible large scale integrated circuits (f-LSI). We fabricated flexible LSI  interconnected with thousand nano-transistors by state-of-the-art 0.18 CMOS process, and then the entire bottom substrate except top circuit layer was removed. This work represents an exciting technology for fully flexible consumer electronics such as application processor (AP) for mobile operating system, high-capacity memory, wireless communication in the near future.


  • Related References

"ACF Packaged Flexible NAND Flash Memory" IEDM, Washington DC, 19.3, 1, 2015

"Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory"  Adv. Mater.28, 8371, 2016 

"Flexible Crossbar Resistive Memory Arrays via Inorganic-based Laser Lift-off "  Adv. Mater., 26, 7480, 2014 

"In vivo Silicon-Based Flexible Radio Frequency Integrated Circuits Monolithically Encapsulated with Bio-compatible Liquid Crystal Polymers" ACS Nano, 7(5), 4545, (2013).

   

Flexible ACF packaging

     Flexible inorganic electronics including LSI and optoelectronics have attracted great attention owing to their merits such as low weight, high portability, low fragility, and high performance. However, there still remains a critical issue to develop transfer process and packaging technology for commercializing flexible devices.

     We have developed innovative flexible packaging technology using flip-chip (FC) bonding with anisotropic conductive film (ACF) as transfer and packaging materials.  Additionally, simultaneous transfer and interconnection of Si-based flexible NAND flash memory was presented for the future signal processing and memory storage.


  • Related References

"ACF Packaged Flexible NAND Flash Memory" IEDM, Washington DC, 19.3, 1, 2015

"Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory"  Adv. Mater.28, 8371, 2016 

"Self-powered Fully-Flexible Light Emitting Systems enabled by Flexible Energy Harvester", Energy Environ. Sci., 7(12), 4035, 2014.

 
 
 
 
 
 
 
 
 

  Room #4106 (N28)

  Energy & Environment Research Center, KAIST

  291 DaeHak-ro Yuseong-gu, Daejeon, Korea, 34141