발명의명칭: 플렉서블 소자 패키징 방법 및 이에 의하여 제조된 플렉서블 소자(Method for packaging flexible device and flexible device manufactured by the same)
Int. CI: H01L 23/538 (2006.01.01) H01L 23/48 (2006.01.01) H01L 23/12 (2006.01.01) H01L 21/78 (2006.01.01) H01L 21/60 (2006.01.01)
출원번호(일자): 1020160032977 (2016.03.18)

A flexible device packaging method according to the present invention includes preparing a device substrate 100; manufacturing an LSI device 300 on the device substrate 100; fixing the temporary substrate 500 with an adhesive 400 to cover the LSI element 300 of the element substrate 100; reducing the thickness of the device substrate 100 by etching the lower surface of the device substrate 100 through a physicochemical method; forming a contact hole through the rear surface of the device substrate 100 and forming a through electrode 600 through the contact hole; disposing an anisotropic conductive film 700 on a lower surface of the device substrate 100, and disposing a flexible circuit board 800 on which a contact electrode 900 is formed under the anisotropic conductive film 700; Ultrasound, heat, pressure, etc. are applied through the upper part of the temporary substrate 500 and the lower part of the flexible circuit board 800 to apply the LSI element 300 of the element substrate 100 and the flexible circuit board 800 to each other. It characterized in that it includes; bonding step.