발명의명칭: 전사 부재를 이용한 전자 소자의 적층 구조 및 상기 전자 소자의 제조 방법(Laminating structure of electronic device using transferring element and method for fabricating the electronic device)
Int. CI: H01L 27/15 (2006.01.01) H01L 33/62 (2010.01.01) H01L 21/78 (2006.01.01) H01L 33/00 (2010.01.01)
출원번호(일자): 1020170062349 (2017.05.19)

A stacked structure of an electronic device using a transfer member according to the present invention includes a target substrate; a lower electrode formed on the target substrate; an electronic device bonded to the lower electrode; a contact electrode formed on the electronic device; a transfer member disposed between the lower electrode and the electronic device on the target substrate; and an upper electrode connected to the electronic device, wherein the transfer member is transferred to the target substrate after contacting the electronic device while being attached to the transfer substrate.