FRONICS
MicroLED Patents

MicroLED Patents

Title micro vacuum module for semiconductor device transfer and method for transfering semiconductor device using the micro vacuum module

Application No. 1020180067701

발명의명칭: 반도체 전사용 마이크로 진공 모듈의 제작 방법 및 상기 마이크로 진공 모듈을 이용한 반도체의 전사 방법(micro vacuum module for semiconductor device transfer and method for transfering semiconductor device using the micro vacuum module)
Int. CI: H01L 21/52 (2006.01.01) H01L 21/67 (2006.01.01) H01L 21/683 (2006.01.01) H01L 21/027 (2006.01.01) H01L 21/677 (2006.01.01)
출원번호(일자): 1020190053754 (2019.05.08)

우선권정보    대한민국  |   1020180076935   |   2018.07.03
                       대한민국  |   1020180067701   |   2018.06.12

 

 

 

반도체 전사용 마이크로 진공 모듈의 제작 방법 및 상기 마이크로 진공 모듈을 이용한 반도체의 전사 방법

 

 

 

In the method of transferring a semiconductor using the micro vacuum module according to the present invention, the micro vacuum module comprises: a vacuum forming substrate having a plurality of connection holes connected to an external pump module and a vacuum control unit; and a pattern forming unit having a single channel or a plurality of independently configured channels in a state coupled to the vacuum forming substrate, wherein the plurality of channels are formed smaller than the size of a semiconductor to be transferred. It is formed to communicate with each vacuum hole, and the plurality of vacuum holes are in contact with a micro-semiconductor having a width and a length of 100 μm or less in a state having a diameter of less than 100 μm, and then, using the suction force of the vacuum, the micro-semiconductor to transcribe

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