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MicroLED Patents

MicroLED Patents

Title Layout structure between substrate, micro LED array and micro vacuum module for micro LED array transfer using micro vacuum module and Method for manufacturing micro LED display using the same

Application No. 1020190081150

발명의명칭: 마이크로 진공모듈을 이용한 마이크로 LED 어레이 전사를 위한 기판, 마이크로 LED 어레이, 마이크로 진공모듈 간의 배치 구조 및 이를 이용한 마이크로 LED 디스플레이 제작 방법(Layout structure between substrate, micro LED array and micro vacuum module for micro LED array transfer using micro vacuum module and Method for manufacturing micro LED display using the same)
Int. CI: H01L 21/67 (2006.01.01) H01L 21/683 (2006.01.01) H01L 25/075 (2006.01.01)
출원번호(일자): 1020190102502 (2019.08.21)

우선권정보    대한민국  |   1020190081150   |   2019.07.05

 

 

 

마이크로 진공모듈을 이용한 마이크로 LED 어레이 전사를 위한 기판, 마이크로 LED 어레이, 마이크로 진공모듈 간의 배치 구조 및 이를 이용한 마이크로 LED 디스플레이 제작 방법

 

 

 

: In the method of transferring a micro LED array using a micro-vacuum module according to the present invention, the micro-vacuum module is formed to communicate with a plurality of adsorption holes and the plurality of adsorption holes in direct contact with the micro LED to be transferred. Contacting the suction holes of the micro vacuum module on a mother board or a temporary board including a single or a plurality of vacuum flow paths and having a micro LED array in the form of a chip; forming a suction force by making a vacuum flow path communicating with the suction holes in contact with the micro LED array in a vacuum state, and peeling the micro LED array from the mother substrate or the temporary substrate using the vacuum; aligning the exfoliated micro LED array on the target substrate to which the conductive transfer member is applied and then releasing; Conducting all of the micro LED arrays having the same color or different colors by performing the peeling, aligning, and releasing processes of the micro LED array on the same color or different color micro LED arrays formed on a different mother substrate or temporary substrate than before transferring the transfer member to a desired position on the target substrate coated thereon; and deforming the transfer member through an external force applying medium to physically contact the target substrate and the micro LED array aligned on the target substrate to electrically interconnect them.

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